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来源:百度知道 编辑:UC知道 时间:2024/07/04 06:24:14
SMT Past Process
_____Automated ______Hand ______Automated with integrated visual correction
SMT component placement on PCB
_____Automated ______Hand Placement _____No SMT Capabilities

Reflow Process:
Number of reflow production line:_______
Maximum PCBA array width:___________
PCBA Feed method:________
Number of heating zones used in reflow machine(s):________
Cleaning Method:________
Lead-Free Reflow Process(Yes/No)_________
SMT bottom side capabilities(Yes/No):_________
Flow or Reflow Soldering on Bottom Side SMT:__________

Post Reflow:
Conformal Coating: _____Manual _____Automated _____None
Testing/Inspection: ____ICT capabilities ____Flying Probe ____Automated Optical
____Dedicated PLC or PC Based (end of line)
PCB Array Separation Method: ____Hand ____Cutter Wheel ____Router ____Hard Tooling
Test Fixtures Designed and

SMT过去的过程
┅自动化的恶棍手里_ _____自动化集成视觉的修正
SMT元件安置在印刷电路板
┅自动化的恶棍手里安置_____没有SMT能力

回流过程。
数量的回流生产线:_ _____
最大PCBA阵列宽度:____ _____
PCBA饲料的方法:____ _____
数量的加热区域用于回流机(s):____ _____
清洗方法:____ _____
无铅回流过程(是/否)___ _____
SMT底侧能力(是/否):____ ___
流量或回流焊在底部的一边SMT:____ _____

邮政回流。
保涂料:____手动_____自动化_____
测试/检测:___ ICT能力___飞针___自动化的光
___专用的可编程序控制器(PLC)或PC机的基础(线)
分离方法:PCB阵列___手___刀轮___路由器___硬工具
测试夹具设计和建造内部_____是的_____没有_____