请帮忙翻译急用哦 重分 星期3中午前要用
来源:百度知道 编辑:UC知道 时间:2024/06/30 01:50:26
因此我着重从SMT(表面组装技术)中贴片机(Placement)精度提高为切入点。以方法论集中研究贴片技术改进方法和解决方案,并在充分掌握各种处理工具和BGA传统算法的基础上,提出了在固定设计中采用的一些新的思路和方法。使其速度达到54.3 msec。本文的解决方案从以下几个方面展开:
对于大量数据精度计算方法的研究及改进。其中包括MaximumDistance演算法,数据统计法等不同精度算法及其优缺点。
对视觉辅助识别系统中研究包括:SMT技术与SMD元器件分析,元件识别算法和流程研究。以期系统的分析和研究出BGA识别过程中遇见的理论和实际问题,最终解决BGA识别相关的核心问题。
China's electronics industry, particularly in surface mount technology (SMT) as a new generation of electronics assembly technology.has been immersed in various industries in various fields.With ever-smaller electronic products, the application of surface mount devices are widely used in such demand,Mounter as a major producer of electronic equipment manufacturers in the importance of becoming more prominent.Identification of SMD components which is the most important point.And the various components, its cost BGA (200 times the cost of ordinary components)high capacity (a huge volume of information storage), complexity (mainly after Mount difficult to detect) featuresit has become the most important element.SMD components can be defined as : whatever the electronic board, the one-sided or two of the crew assembling surface,Bond pad and the face plate for engagement and the current conduction.then by foot lap electronic components which will be filled with solder. So I focus on