请帮忙翻译急用哦 重分 星期3中午前要用

来源:百度知道 编辑:UC知道 时间:2024/06/30 01:50:26
中国的电子工业,特别是以表面安装技术(SMT)作为新一代的电子装联技术,己经浸透到各个行业,各个领域。随着电子产品体积越来越小,表面安装器件的应用也越来越广泛,在这种需求下,贴片机作为一种主要生产设备在电子制造中的重要性也日益突出。其中对SMD元件的辨识的最为重要的一点。而在各种元件中,BGA以其高成本性(是普通元件成本200倍),高容量性(信息储存量巨大),复杂性(主要指贴装后难以检测)等特点,使其成为最为重要的元件。SMD可定义为:凡是该电子零件可在机板上的单面或俩面进行装配,并与板面的焊垫进行接合及电流的导通,由搭接电子元件接脚将焊锡填充其中.
因此我着重从SMT(表面组装技术)中贴片机(Placement)精度提高为切入点。以方法论集中研究贴片技术改进方法和解决方案,并在充分掌握各种处理工具和BGA传统算法的基础上,提出了在固定设计中采用的一些新的思路和方法。使其速度达到54.3 msec。本文的解决方案从以下几个方面展开:
对于大量数据精度计算方法的研究及改进。其中包括MaximumDistance演算法,数据统计法等不同精度算法及其优缺点。
对视觉辅助识别系统中研究包括:SMT技术与SMD元器件分析,元件识别算法和流程研究。以期系统的分析和研究出BGA识别过程中遇见的理论和实际问题,最终解决BGA识别相关的核心问题。

China's electronics industry, particularly in surface mount technology (SMT) as a new generation of electronics assembly technology.has been immersed in various industries in various fields.With ever-smaller electronic products, the application of surface mount devices are widely used in such demand,Mounter as a major producer of electronic equipment manufacturers in the importance of becoming more prominent.Identification of SMD components which is the most important point.And the various components, its cost BGA (200 times the cost of ordinary components)high capacity (a huge volume of information storage), complexity (mainly after Mount difficult to detect) featuresit has become the most important element.SMD components can be defined as : whatever the electronic board, the one-sided or two of the crew assembling surface,Bond pad and the face plate for engagement and the current conduction.then by foot lap electronic components which will be filled with solder. So I focus on